High-pulse energy picosecond laser systems provide industrial-level reliability combined with the performance features required for many ultrafast material processing applications. Current diode pumped solid-state systems provide pulse energies into the 100’s of microjoules at 1064 nm wavelength and pulse widths of approximately 10 picoseconds, which allows effective “cold” ablation of most materials with high efficiency. Average power of these systems is scalable up to 50 W and will further increase into the multi-100 W range, allowing for very high speed picosecond micromachining.
Our leadership in innovations and development of ultrafast lasers for materials processing is recognized by worldwide community. Please take a look at the micromaching review article by Dr. Kurt Weingarten, CTO of Time-Bandwidth Products AG in Laser Technik Journal, volume 6, issue 3, pp. 51-54
, about high energy picosecond lasers and the basics of picosecond micromachining.
In our two applications labs at Berner Fachhochschule
and Fachhochschule Nordwestschweiz, Windisch,
both in Switzerland, we can perform feasibility studies of sample material processing. Please contact us with your demanding ultrafast laser material processing requirements.